December 13-15, 2023
Tokyo Big Site Conference Centre | Tokyo, Japan

Co-located with FLEX Japan and Advanced Packaging and Chiplet Summit (APCS)

SEMICON Japan is a premium international exhibition for the electronics manufacturing supply chain, covering manufacturing technologies, equipment, and materials in the semiconductor industry, as well as SMART applications such as cars and IoT devices.

FLEX Japan is the golden opportunity to discuss around flexible hybrid and printed electronics products, emphasizing the latest technical breakthroughs, unique electronics applications, and business strategies. APCS is for top players in semiconductor packaging and PCB mounting to introduce technologies and innovations in semiconductor packaging.​

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