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The IEEE Electronic Components and Technology Conference (ECTC) is the world’s leading forum for announcing, discussing and exhibiting the latest advances in microelectronics packaging and component science and technology. In particular, more than 1,500 scientists, engineers and businesspeople from 20+ countries will attend, along with more than 115 exhibitors.
Sponsored by the IEEE Electronics Packaging Society (formerly CPMT), the strongly technical programme contains more than 375 technical papers in 36 oral and five interactive sessions; 10 special topic sessions; numerous professional development opportunities; a student poster session; and 115+ exhibitors in the ECTC Technology Corner exhibit area.
Additionally, attendees can drill down into developments across a wide range of packaging areas, including heterogeneous integration, photonics, components, materials, assembly, reliability, modelling, interconnect design and technology, 2.5D/3D integration technologies, direct/hybrid bonding, device/system packaging, wafer-level packaging, optoelectronics and more.
IEEE is the world’s largest technical professional organization and is dedicated to advancing technology for the benefit of humanity. It works in a wide variety of areas ranging from aerospace systems, computers and telecommunications, to biomedical engineering, electric power, and consumer electronics.
The IEEE’s Electronics Packaging Society (EPS) is the leading international forum for scientists and engineers engaged in research, design and development of revolutionary advances in microsystems packaging and manufacturing, covering all aspects of packaging and integration of electrical, electronic, optoelectronic, biological, micromechanical and sensing components.
